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Phone：15818564424
Email：Sandy@tingyongsheng.com
Address：Xinhua Innovation Technology Park,Huangxing Village, Taibai Road, Guanlan Street,Longhua New District, Shenzhen
communication products
Material: FR4
0.3mm QFP pitch
Layer count: 4 layers
Board thickness: 1.6mm
Surface technique: HAL lead-free
Minimum hole size: 0.25mm
Copper thickness: 1oz
Solder mask: green
Application field: communication products
