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Phone:15818564424
Email:Sandy@tingyongsheng.com
Address:Xinhua Innovation Technology Park,Huangxing Village, Taibai Road, Guanlan Street,Longhua New District, Shenzhen




> SMT & DIP Assembly

Ting Yongsheng Technology Co., LTD., founded in 2009, is a high-tech innovative enterprise based on high-end electronic manufacturing services. The company has been committed to providing customers with high-quality PCB board, ASMT welding, plug-in after welding and other one-stop services, as well as all kinds of electronic products R & D, manufacturing and sales.
The company has advanced production equipment, such as high-precision CNC punching machine, laser cutting machine, corrosion production line and so on. As well as a group of experienced, skilled R & D team and engineering team. At the same time, the company strictly follows the international quality management system, to ensure that every product can meet customer expectations, to provide customers with quality products and satisfactory service.
Ting Yongsheng Technology Co., LTD. PCBASMT and plug-in after welding production process, leading the development trend of the industry. The company adopts efficient production process, precise automated production equipment, and strict quality management system to provide customers with high quality PCB board and excellent ASMT welding services. At the same time, Ting Yongsheng Technology Co., Ltd. also has the industry’s leading plug-in post-welding production line, with high-speed, high precision, strong reliability of plug-in capabilities, to provide customers with perfect electronic product manufacturing services.
In short, Ting Yongsheng Technology Co., Ltd. by virtue of its strong technical strength, excellent manufacturing quality and excellent service, has won widespread praise and customer trust in the industry. I believe that in the future, Ting Yongsheng Technology Co., Ltd. will continue to maintain a leading position, create more value for customers, and lead the development of electronic manufacturing industry!

Parameter

Surface mount technology (SMT) is an advanced technology for mounting components on printed circuit boards (PCBs). Here is the detailed process of SMT assembly:

● Preparation:

Gather all the required components (e.g. integrated circuits, resistors, capacitors, etc.) and PCB boards.

Prepare SMT equipment, including placement machines, ovens, etc.


● Printing stencil:

Apply a layer of solder paste on the PCB board. The solder paste determines the exact position of the component on the PCB board.

● Component Positioning:

Using an SMT placement machine, the component is removed from the component library and precisely positioned in the appropriate location on the PCB. This process is usually automated.


● Soldering:

The PCB is fed into an oven, which is heated by hot air or infrared to melt the solder paste and fix the components on the PCB.


● SMD stage:

On the conveyor belt of the SMT equipment, the components are precisely placed on the solder paste under a high-speed conveyor.

● Reflow Soldering:

The PCB board passes through a temperature gradient region in the reflow oven. In the high temperature zone, the solder paste melts and completes the soldering, while in the lower temperature zone, the solder paste cools and solidifies.


● Quality Inspection:

Solder quality is checked using tools such as automated optical inspection (AOI) or X-ray inspection (X-ray) to ensure that components are correct and well soldered.


● Secondary operations:

Perform any manual or automated refill soldering, cleaning, or calibration work, if required.


● Functional Test:

Perform functional tests on completed PCBs to ensure they meet design requirements.

● Packaging and Shipping:

Packaging the completed PCBs into appropriate containers ready for shipment to the customer or to the next stage of manufacturing.

Please note that SMT assembly is a highly precise process that usually requires specialised equipment and training of experienced staff to ensure quality and efficiency. Also, the performance and process parameters of equipment such as placement machines and ovens need to be adjusted according to specific component and PCB board requirements.