Your Location：Home > Products & Equipment > Products > PCB Assembly
Phone：15818564424
Email：Sandy@tingyongsheng.com
Address：Xinhua Innovation Technology Park,Huangxing Village, Taibai Road, Guanlan Street,Longhua New District, Shenzhen
mobile telephones
Material: FR4
0.3mm QFP pitch
Layer count: 4 layers HDI
Board thickness: 1.6mm
Surface technique: immersion gold
Minimum hole size: 0.15mm
Copper thickness: 1oz
Solder mask: green
Application field: mobile telephones
